They say “beauty is in the eye of the beholder.” When you behold Bergquist HC3.0, there can surely be no doubt about that statement: it truly is a beautifully crafted piece of thermal engineering.
This exceptional material offers exceptional thermal performance at low pressures due to its unique 3.0W/m-K filler package and low-modulus resin formulation. With just 15 shore (00) hardness, the enhanced material is ideal for assembly applications requiring low stress on components and boards.
HC3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even on surfaces with highly irregular topography.
A wide range of thicknesses is available from 0.5mm up to 3.0mm, and performance is improved by the natural inherent tack on both sides of the material. That eliminates the need for adhesive layers, which can impede the thermal performance.
HC3.0 is available from Thermal Issues in a very distinctive cool blue. Contact us for more information.
Best regards – Neil